GLOBALFOUNDRIES Principal Engineer (m/f) - FEoL Process Integration in Dresden, Germany

Shaping the future with innovation and smart technologies .... our growth offers development opportunities for your career

We are Europe’s largest semiconductor manufacturing location, combining smart solutions with leading edge technologies in our Dresden Foundry - for our customers, for groundbreaking products and for a sustainable future. In addition to our existing manufacturing of 28nm semiconductor products, our new 22nm technology (22FDX) sets standards with regard to energy efficiency and performance. With our energy saving technology, we are targeting the growth markets of the future: the 'Internet of Things', including areas such as Industry 4.0, Wearables and Automotive. With the development of our next technology generation (12FDX), we want to continue this path consistently.

Principal Engineer (m/f) - FEoL Process

Your tasks:

As Process Integration Engineer FEOL you will be part of the FEOL Integration department, participating in advance technology development in GLOBALFOUNDRIES' state-of-the-art 300 mm wafer fab (Fab1) in Dresden, Germany. Reporting to the Fab1 FEOL Integration management, the primary responsibility of this position is to manage an integrated CMOS process flow, drive improvements to enhance yield and manufacturability of this flow, ensure smooth movement of prototypes and critical lots through the manufacturing line as well as meet Fab1 customer’s needs.

  • Your specific responsibilities will include but are not limited to: *

• Owner of an integration module in FEOL • Lead cross functional teams to address and solve complex issues • Interact directly with customers, providing technical guidance and reports. • Develop and implement technological enhancements to existing baseline flows to meet our customer’s needs and our internal goals (cost reduction, synchronization etc). • Interact with a number of Fab1 teams (Integration, CFM , Module Engineering, Yield Engineering, Device Engineering, OPC, Quality) to continuously drive down on-product defectivity, increase process margin and increase yield.

Your profile:

• B.Sc. in Chemistry, Electrical Engineering, Materials Science, Solid State Physics or other relevant technical discipline is required. • Several years of semiconductor process experience in process integration or multiple process modules desired, experience in advanced technology (28nm and below is preferred). • You should have a solid working knowledge of modern CMOS process integration, with exposure to Front End of Line (FEoL) integration. Solid foundation in statistics, data analysis techniques and tools (JMP, Exensio) • Exposure to technology transfer methods, external customer interactions and multi-culture working environments would be very beneficial. • In addition to technical proficiency, all candidates must have proven project management, peer leadership skills as well as the interpersonal skills required to work in high-performance cross-functional teams. The ability to work independently is a prerequisite. • Excellent oral and written communication and strong interpersonal skills are required. • Previous exposure to multi-cultural environments is a plus. • Excellent English skills are required, proficiency in the German language is preferred.

Organization: *FAB 1 INT FEoL-00084458

Title: Principal Engineer (m/f) - FEoL Process Integration

Location: Europe %26 Middle east Region-Germany-Saxony-Dresden-DE, Dresden

Requisition ID: 17004312